Seminar Schedule – Spring 2021

Thursday, April 29, 2021
Time: 3:30pm – 4:30pm
This seminar will be held virtually via Zoom in email announcement

Advances in Integrated Digital Image Correlation, Integrated Digital Height Correlation, and Mechanical Shape Correlation

Johan Hoefnagels, Eindhoven University of Technology (TU/e), the Netherlands

In the field of full-field model parameter identification, Integrated Digital Image Correlation (IDIC) was introduced a decade ago as a one-step method to directly correlate digital images by optimizing the parameters of a FEM model of the specimen, making it more accurate than the two-step method of element model updating (FEMU), particularly in challenging test cases (small displacements, complex kinematics, specimen misalignment, image noise). Recently, the IDIC family was extended with correlation of Height profiles instead of Images, named IDHC, while Mechanical Shape Correlation (MSC) was introduced for correlation of the specimen contour for cases where the specimen rotates out of view. In this presentation, I will present the pitfalls, challenges and eventual successful application of IDIC, IDHC, and MSC for (i) mixed-mode interface identification in microelectronics, (ii) correction of SEM imaging artifacts, (iii) absolute cross-grain stress and orientation correlation using EBSD, (iv) time-dependent anelasticity characterization in MEMS microbeams, and (iv) parameter identification of micron-sized freestanding stretchable electronic interconnects.

For further information, please contact Dr. Ken Liechti at kml@mail.utexas.edu or (512) 471-4164.