2022 Fall

Sponsored by:

• HBM3 RAS: The Journey to Enhancing Die-Stacked DRAM Resilience at Scale
  Speaker: Sudhanva Gurumurthi (AMD)
  Date: November 8, 2022 at 3:30pm
  Location: EER 3.646
• Accelerating the Pace of AWS Inferentia Chip Development, From Concept to End Customer Use
  Speaker: Randy Huang, Amazon AWS
  Date: October 18, 2022 at 3:30pm
  Location: EER 3.646
• Benchmarking a New Paradigm: An Experimental Analysis of a Real Processing-in-Memory Architecture
  Speaker: Juan Gómez Luna, ETH Zurich
  Date: September 20, 2022 at 3:30pm
  Location: EER 3.646 or Zoom