Sponsored by:
- HBM3 RAS: The Journey to Enhancing Die-Stacked DRAM Resilience at ScaleSpeaker: Sudhanva Gurumurthi (AMD)
Date: November 8, 2022 at 3:30pm
Location: EER 3.646 - Accelerating the Pace of AWS Inferentia Chip Development, From Concept to End Customer UseSpeaker: Randy Huang, Amazon AWS
Date: October 18, 2022 at 3:30pm
Location: EER 3.646 - Benchmarking a New Paradigm: An Experimental Analysis of a Real Processing-in-Memory Architecture