Oxford RIE 80

1.login

• user: user
• password: user

2.pre-cleaning
(If the chamber is already evacuated, we can directly run “O2 clean” recipe; If not, we neet to evacuate the chamber first.)

• “process”
• “recipes”
• “load”
• “Oxygen Plasma”->edit the processing time to 30 mins or 60 mins.
• “run”

3.sample loading

• place your sample on the wipe

• When the O2 clean is done, blue alert pops up. ->”continue”

• wait until the “vent time left” less than 600 secs.
• turn “chamber up” and press two “chamber hoist” simutiniously to open the chamber.

• load your sample onto the chuck
  • taping the flat edge of a wafer to avoid scratch due to wafer tweezer if you have a film.
• turn “chamber down” and press two “chamber hoist” buttons to close the chamber.

4.run etching recipe

• “stop”
• “evacuate”
• wait penning pressure less than e-5 Torr.
• “process”
• “recipes”
• “load”
• select your recipe and “run”
  • when the recipe is done, the chamber is vented automatically.

5.unload sample

• turn “chamber up” and press two “chamber hoist” buttons to open the chamber.
• remove your wafer and place it onto the wiper in the glove box.
• turn “chamber down” and press two “chamber hoist” buttons to close the chamber.
• “stop”
• “evacuate”
• select “cancel” if you don’t load a wafer.

you can leave now 🙂