1.login
- user: user
- password: user
2.pre-cleaning
(If the chamber is already evacuated, we can directly run “O2 clean” recipe; If not, we neet to evacuate the chamber first.)
- “process”
- “recipes”
- “load”
- “Oxygen Plasma”->edit the processing time to 30 mins or 60 mins.
- “run”
3.sample loading
- place your sample on the wipe
- When the O2 clean is done, blue alert pops up. ->”continue”
- wait until the “vent time left” less than 600 secs.
- turn “chamber up” and press two “chamber hoist” simutiniously to open the chamber.
- load your sample onto the chuck
- taping the flat edge of a wafer to avoid scratch due to wafer tweezer if you have a film.
- turn “chamber down” and press two “chamber hoist” buttons to close the chamber.
4.run etching recipe
- “stop”
- “evacuate”
- wait penning pressure less than e-5 Torr.
- “process”
- “recipes”
- “load”
- select your recipe and “run”
- when the recipe is done, the chamber is vented automatically.
5.unload sample
- turn “chamber up” and press two “chamber hoist” buttons to open the chamber.
- remove your wafer and place it onto the wiper in the glove box.
- turn “chamber down” and press two “chamber hoist” buttons to close the chamber.
- “stop”
- “evacuate”
- select “cancel” if you don’t load a wafer.
you can leave now 🙂