DSE/DRIE(ICP Deep Silicon Etcher Plasma Therm Versaline)

Please watch the video before getting the training:

https://drive.google.com/file/d/1YiZoSpNw6-Z8PKnfCJFVTS9ym32hHBbT/view

1. Login
   
2. O2 clean dummy wafer
   1. “vent”
   2. open the load lock when the display shows “atmosphere”
   3. load dummy wafer
   4. Align major bar of the wafer with the line on the loading bar
   5. close the load lock. Need to take the device.
      
   6. load and run (“start job”) the O2 clean recipe.
      
3. dummy wafer unloading
   • unload the dummy wafer when the O2 clean completed.
   • The display should show “atmosphere”, because we select the function “vent after job”.
     
4. sample loading
   1. load your wafer sample onto the wafer loading bar.
   2. align major flat of your wafer with the line on the loading bar.
   3. close the load bar.
      
5. Recipe check
   • “editors”->”seq editor”->”loop editor”
   • check the if the “loop” works. If not, change the appropriate loops.
     
6. “start job”
   
7. sample unloading
   • when the recipe is run off, the systems automatically vents. So, if we see the “atmosphere” shows, we may unload our wafer.
     
8. you can leave 🙂