When I etch silicon wafers, I’m thinking about how to check the depth of my etching. Jesse and Dr. Yu Wang told me that I need to cut the wafer into tripes and then use the SEM to check the cross-section. However, I don’t know how to cut the wafer into stripes.
I’m surprised that the orientation of the lattice decides the breaking orientation.
Dr. Yu Wang and I conducted a simple experiment.
https://drive.google.com/drive/folders/1H3I3gi-rDjZr4-FYwzZ8p54WrGdFCDu3?usp=sharing