July 9, 2021, Filed Under: MEMS processingsilicon wafer orientation When I etch silicon wafers, I’m thinking about how to check the depth of my etching. Jesse and Dr. Yu Wang told me that I need to cut the wafer into tripes and then use the SEM to check the cross-section. However, I don’t know how to cut the wafer into stripes. I’m surprised that the orientation of the lattice decides the breaking orientation. Dr. Yu Wang and I conducted a simple experiment. https://drive.google.com/drive/folders/1H3I3gi-rDjZr4-FYwzZ8p54WrGdFCDu3?usp=sharing