Oxford ICP RIE Etcher

1.Login

• user: guest
• password: guest

2.Venting

• “stop”
• “vent”. Wait until time is less than 90 secs.

3.dummy wafer loading

• open the Load Lock and load the dummy wafer.
  • don’t touch the wafer belt.
• “stop”
• “evacuate”
  • Pirani guage will be decreased.
  • Penning guage should be decreased until e-5

4.pre-cleaning step

• “process”
• “recipes”
• “load”
• “O2 chamber clean”
• left click “process step” and edit the “process time” to “60 min” or “30 min”
• “run”
• when the process is done, yellow warning message will come up then press “accept” button

5.dummy wafer unloading

• “stop”
• “vent”
• open the Load Lock and unload the dummy wafer.

6.Sample loading

• Mount your sample on the surface of the dummy wafer using tap or oil.
• Load the dummy wafer and your sample to the Load Lock again.
• “stop”
• “evacuate”. wait the penning guage until it reaches e-5.

7.recipe running

• “process”
• “recipes”
• “load”
• “run”

the plasma is working.

• When the recipe is done, the yellow alert shows again. ->”accept”

8.unload your sample

• “stop”
• “vent”
• take your sample out of the Load Lock.

• “stop”
• “evacurate”

now you are done and you can leave.