Ball Bonder User Manual

• perfectly flat!!!
• perfectly smooth!!!
• perfectly rigid!!!
• perfectly stable!!!

1. turn on the tool

• there is a buttern at the back of the tool. Turn on that buttern.
• there is another circle buttern at the front screen. Turn this buttern.

2. adjust the height

• search is always 1.44

3. adjust the parameters

(the ball should be like a hemisphere. if the ball is like an egg, there is too much power. )

(“ball to ball” is recommended.)

• normal settings [for PCB board]
  • standard mode – ball bonding
    • power: ~2
    • time: 3
    • force: 1.73
  • standard mode – wedge bonding
    • power: ~4
    • time: 5
    • force: 1.7
• 1/8” tubing package
  • Kovar rods, ball bonding
    • power: ~6
    • time: 5
    • force: 2.5
  • Kovar rods, wedge bonding
    • power: ~6
    • time： 5
    • force: ~1.7
  • MEMS die, ball bonding
    • power: ~4
    • time: 5
    • force: ~1.7

4. heat the PCB board or tubing packages to 100 C deg. – 150 C deg.

5. start wire bonding