PECVD – 790 Plasma Therm #1

1.select input

“display” – “SDU”

2.vent chamber

3.clean chamber

Clean the chamber before the first process is started. Wipe the walls and any quartz wafer holders with water.

4.put the wafer to the holder

be careful! the holder might be hot.

5.pump down the chamber

“pump chamber” – “low vacuum”

Once you click the “low vacuum”, push the chamber lid quickly.

6.load and run O2 clean recipe

“process” – “load” for 10 – 30 min

“O2cln100.prc”

7.vent the chamber

8.load our wafers

9. run the recipe

As for SiO2 deposit, usually choose 335 deg. C, because the tool cannot reach out to 350 deg. C.

Sinwoo recipe: 25 mins – 1.2um SiO2

10.take out our wafer and pump down the chamber

you are good to go 🙂