According to the official document of the negative photoresist SU8-3005, we know there are two methods to remove the SU8 PR. (1.) PR Remover immersion (2.) Dry-etch using SF6. When I preparing the Al2O3 mask for the DSE, I find the difference between the two methods, so this post is… read more
MEMS processing
Oxford ICP RIE Etcher
1.Login user: guest password: guest 2.Venting “stop” “vent”. Wait until time is less than 90 secs. 3.dummy wafer loading open the Load Lock and load the dummy wafer. don’t touch the wafer belt. “stop” “evacuate” Pirani guage will be decreased. Penning guage should be decreased until e-5 4.pre-cleaning step “process”… read more
Aligner (EVG 620): calibrate UV intensity
Sometimes we find the photolithography isn’t that successful. The reason might be the exposure. Normally the UV intensity of the EVG 620 Aligner is 12 mW/cm2. However, it varies overusing. Therefore, it’s necessary to know the current UV intensity. This post shows how to measure the UV intensity instructed by… read more