The main differences among etchers are size and gas. ICP RIE Etchers 2300 Exelan Flex LAM DSE Oxford 100 STS wafer size 300mm >100mm >100mm material Silicon Silicon, metals C4F8 yes yes SF6 yes yes CF4 yes yes O2 yes yes yes yes Ar yes yes yes yes He yes… read more
MEMS processing
How to distinguish P-type or N-type wafer?
silicon wafer orientation
When I etch silicon wafers, I’m thinking about how to check the depth of my etching. Jesse and Dr. Yu Wang told me that I need to cut the wafer into tripes and then use the SEM to check the cross-section. However, I don’t know how to cut the wafer… read more