MEMS processing

Sometimes, we need material to work as masks for the Deep Silicon Etch. The available masks are Al2O3, SiO2, PR, and Cr. If we want to etch about 500 microns, Al2O3 masks are the ideal ones. It’s because Al2O3 is simple to be deposited using the ALD Banerjee. However, there’s… read more 

Please watch the video before getting the training: https://drive.google.com/file/d/1YiZoSpNw6-Z8PKnfCJFVTS9ym32hHBbT/view Login O2 clean dummy wafer “vent” open the load lock when the display shows “atmosphere” load dummy wafer Align major bar of the wafer with the line on the loading bar close the load lock. Need to take the device. load… read more 

“CAS Mounted DSE Standard” Because 2-micron etch doesn’t need to be aggressive, we need to decrease the ICP RF Power. Figure 1 shows Carly’s recipe; Figure 2 shows DHF’s recipe. We may find the different parameters of the RF power setting. So, the rates of them are different.