Book Chapters

S.-K. Ryu, T. Jiang, J. Im, R. Huang, P.S. Ho, Thermal Stress in 3-D Packaging.
In: Encyclopedia of Thermal Stresses (Editor: Hetnarski RB), Vol x, pp 5208-5217. Springer Dordrecht, 2014.
R. Huang, A Kinetics Approach to Surface Wrinkling of Elastic Films.
Chapter 5 in: Mechanical Self-Assembly: Science and Applications (Editor: X. Chen), Springer, 2013.
Q. Lu and R. Huang, Mechanical Behavior of Monolayer Graphene by Continuum and Atomistic Modeling.
Chapter 14 in: Simulations in Nanobiotechnology (Editor: K. Eom), CRC Press, 2011.
X. Zhang, S. H. Im, R. Huang, P. S. Ho, Chip-Packaging Interaction and Reliability Impact on Cu/Low-k Interconnects.
Chapter 2 in: Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Editors: M. Bakir and J. Meindl), Artech House, Norwood, MA, 2008.