Conference Papers

S. Hao, W. Chu, P. S. Ho, J. S. Lee, R. Huang, Analytical and finite element study on warpage and stress of 2.5D chip-package structures. Proc. 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). DOI: 10.1109/IPFA53173.2021.9617246
C. Wu, T. Jiang, J. Im, K. M. Liechti, R. Huang, P. S. Ho,
Material characterization and failure analysis of through-silicon vias.
Proc. IEEE 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
pp. 312-316 (Singapore, June 30-July 4, 2014).
DOI: 10.1109/IPFA.2014.6898206.
T. Jiang, C. Wu, P. Su, P. Chia, L. Li, H.-Y. Son, M.-S. Suh, N.-S. Kim, J. Im, R. Huang, P.S. Ho,
Effect of high temperature storage on the stress and reliability of 3D stacked chip.
Proc. IEEE 64th Electronic Components and Technology Conference (ECTC), pp. 1122-1127 (Orlando, FL, May 27-30, 2014).
DOI: 10.1109/ECTC.2014.6897430.
T. Jiang, C. Wu, J. Im, R. Huang, P.S. Ho,
Effect of microstructure on via extrusion profile and reliability implication for copper through-silicon vias (TSVs) structures.
Proc. 2014 IEEE International Interconnect Technology Conference/Advanced Metallization Conference (IITC/AMC),
pp. 377-380 (San Jose, CA, May 20-23, 2014).
DOI: 10.1109/IITC.2014.6831838.
T. Jiang, S.-K. Ryu, Q. Zhao, J. Im, P.S. Ho, R. Huang,
Thermomechanical characterization and modeling for TSV structures.
AIP Conf. Proc. 1601, 148-157 (2014).
DOI: 10.1063/1.4881348.
T. Jiang, S.-K. Ryu, J. Im, R. Huang and P.S. Ho,
Characterization of thermal stresses and plasticity in through-silicon via structures for three-dimensional integration.
AIP Conf. Proc. 1601, 55-66 (2014).
DOI: 10.1063/1.4881340.
H. Mei and R. Huang,
Wrinkling and Delamination of Thin Films on Compliant Substrates.
Proc. 13th International Conference on Fracture (June 2013, Beijing, China), pp. 1-9.
Tengfei Jiang, Suk-Kyu Ryu, Jay Im, Ho-Young Son, Nam-Seog Kim, Rui Huang, Paul S Ho,
Impact of material and microstructure on thermal stresses and reliability of through-silicon via (TSV) structures.
Proc. 2013 IEEE International Interconnect Technology Conference (IITC), pp. 1-3 (June 2013, Kyoto, Japan).
Tengfei Jiang, Chenglin Wu, Peng Su, Xi Liu, Pierre Chia, Li Li, Ho-Young Son, Jae-Sung Oh, Kwang-Yoo Byun,
Nam-Seog Kim, Jay Im, Rui Huang, Paul S Ho,
Characterization of plasticity and stresses in TSV structures in stacked dies using synchrotron x-ray microdiffraction.
Proc. 2013 IEEE Electronic Components and Technology Conference (ECTC), 641-647 (May 2013, Las Vegas, NV).
Qiu Zhao, J. Im, R. Huang, P.S. Ho,
Extension of micro-Raman spectroscopy for full-component stress characterization of TSV structures.
Proc. 2013 IEEE Electronic Components and Technology Conference (ECTC), 397-401 (May 2013, Las Vegas, NV).
Tengfei Jiang, Suk-Kyu Ryu, Qiu Zhao, Jay Im, Ho-Young Son, Kwang-Yoo Byun, Rui Huang, Paul S Ho,
Thermal stress characteristics and reliability impact on 3-D ICs containing through-silicon-vias.
Proc. 2012 IEEE 11th International Conference on Solid-State and Integrated Circuit Technology (ICSICT),
pp. 1-3 (Xi’an, China, October 2012).
doi: 10.1109/ICSICT.2012.6467715.
Tengfei Jiang, Suk-Kyu Ryu, Qiu Zhao, Jay Im, Ho-Young Son, Kwang-Yoo Byun, Rui Huang, Paul S Ho,
Thermal Stress Characteristics and Impact on Device Keep-out Zone for 3-D ICs Containing Through-Silicon-Vias.
Proc. 2012 IEEE Symposium on VLSI Technology, 103-104 (Honolulu, HI, June 2012).
doi: 10.1109/VLSIT.2012.6242482.
Q. Lu and R. Huang,
Nonlinear Mechanical Properties of Graphene Nanoribbons,
MRS Symposium Proceedings, vol. 1284, mrsf10-1284-c14-02 (2011).
DOI: 10.1557/opl.2011.226.
K.H. Lu, S.-K. Ryu, Q. Zhao, K. Hummler, J. Im, R. Huang, P. S. Ho,
Temperature-dependent Thermal Stress Determination for Through-Silicon-Vias (TSVs) by Combining Bending Beam Technique with Finite Element Analysis.
Proc. IEEE Electronic Components and Technology Conference (ECTC), 1475-1480 (Lake Buena Vista, FL, 2011).
DOI: 10.1109/ECTC.2011.5898705.
J. Mitra, M. Jung, S.-K. Ryu, R. Huang, S.-K. Lim, D. Z. Pan,
A fast simulation framework for full-chip thermo-mechanical stress and reliability analysis of through-silicon-via based 3D ICs.
Proc. IEEE Electronic Components and Technology Conference (ECTC), 746-753 (Lake Buena Vista, FL, 2011).
DOI: 10.1109/ECTC.2011.5898596.
K.-H. Lu, S.-K. Ryu, J. Im, R. Huang, P. S. Ho,
Thermomechanical reliability of through-silicon vias in 3D interconnects.
Proc. 2011 IEEE International Reliability Physics Symposium (IRPS), 3D.1 (Monterey CA, 2011).
DOI: 10.1109/IRPS.2011.5784487.
S.-K. Ryu, K.-H. Lu, J. Im, R. Huang, P. S. Ho,
Stress-Induced Delamination Of Through Silicon Via Structures.
In: International Workshop on Stress Management for 3D ICs Using Through Silicon Vias.
AIP Conf. Proc. 1378, 153-167 (2011).
DOI: 10.1063/1.3615702.
H. Mei, S. Gowrishankar, K. M. Liechti, R. Huang,
Initiation and propagation of interfacial delamination in integrated thin-film structures.
Proc. 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
pp. 1-8 (Las Vegas, NV, June 2010).
DOI: 10.1109/ITHERM.2010.5501290.
K.H. Lu, S.-K. Ryu, Q. Zhao, X. Zhang, J. Im, R. Huang, P. S. Ho,
Thermal stress induced delamination of through silicon vias in 3-D interconnects.
Proc. IEEE Electronic Components and Technology Conference (ECTC), 40-45 (Las Vegas, NV, 2010).
DOI: 10.1109/ECTC.2010.5490883.
S.-K. Ryu, K.-H. Lu, X. Zhang, J. Im, P. S. Ho, R. Huang,
Thermomechanical Reliability Challenges For 3D Interconnects With Through-Silicon Vias.
In: 11th International Workshop on Stress-Induced Phenomena in Metallization.
AIP Conf. Proc. 1300, 189-201 (2010).
doi: 10.1063/1.3527126.
K.H. Lu, X. Zhang, S.-K. Ryu, J. Im, R. Huang, P. S. Ho,
Thermo-mechanical reliability of 3-D ICs containing through silicon vias.
Proc. IEEE Electronic Components and Technology Conference (ECTC), 630-634 (San Diego, CA, 2009).
DOI: 10.1109/ECTC.2009.5074079.
K.H. Lu, X. Zhang, S.-K. Ryu, R. Huang, P. S. Ho,
Thermal Stresses Analysis of 3-D Interconnect.
In: 10th International Workshop on Stress-Induced Phenomena in Metallization.
AIP Conf. Proc. 1143, 224-230 (2009).
doi: 10.1063/1.3169263.
X. Zhang, R. S. Smith, R. Huang, P. S. Ho,
Chip-Package Interaction and Crackstop Study for Cu/Ultra low-k Interconnects.
In: 10th International Workshop on Stress-Induced Phenomena in Metallization.
AIP Conf. Proc. 1143, 197-203 (2009).
doi: 10.1063/1.3169259.
X. Zhang, S.-K. Ryu, R. Huang, P. S. Ho, J. Liu, D. Toma,
Impact of process induced stresses and chip-packaging interaction on reliability of air-gap interconnects.
Proc. 2008 IEEE International Interconnect Technology Conference (IITC), 135-137 (Burlingame, CA, 2008).
DOI: 10.1109/IITC.2008.4546947.
H. Mei, Y. Pang, S. H. Im, R. Huang,
Fracture, delamination, and buckling of elastic thin films on compliant substrates.
Proc. 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm),
pp. 762-769 (Orlando, FL, May 2008).
DOI: 10.1109/ITHERM.2008.4544345.
B. Li, H. Huang, Q. Zhao, Z. Luo, J.-H. Im, P.S Ho, M.K. Kang, R. Huang, and M.W. Cresswel,
Mechanical Characterization of High Aspect Ratio Silicon Nanolines.
In: Mechanics of Nanoscale Materials (edited by C. Friesen, R.C. Cammarata, A. Hodge, O.L. Warren);
MRS Symposium Proceedings, vol. 1086E (2008), 1086-U05-07.
Y. Pang and R. Huang,
Influence of interfacial delamination on channel cracking of brittle thin films.
In: Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics
(edited by Q. Lin, E.T. Ryan, W-L. Wu, D.Y. Yoon);
MRS Symposium Proceedings, vol. 990 (2007), 0990-B06-04.
Y. Pang and R. Huang,
Pattern Evolution of Self-Assembled Quantum Dots Under Biaxial Stresses.
In: Nanomanufacturing (edited by F. Stellacci, J.W. Perry, G.S. Herman, and R.N. Das);
MRS Symposium Proceedings, vol. 921E (2006), 0921-T07-08.
R. Huang, C.M. Stafford, B.D. Vogt,
Wrinkling of ultrathin polymer films.
In: Mechanics of Nanoscale Materials and Devices (edited by A. Misra, J.P. Sullivan, H. Huang, K. Lu, and S. Asif);
MRS Symposium Proceedings, vol. 924E (2006), 0924-Z04-10.
S.H. Im and R. Huang,
Morphological instability and kinetics of an elastic film on a viscoelastic layer.
Proceedings of IUTAM Symposium on Size Effects on Material and Structure Behavior
at Micron- and Nano-Scales (Eds. Q.P. Sun and P. Tong, Hong Kong, 31 May – 4 June, 2004), pp. 41-50 (2006).
D.W. Gan, R. Huang, P.S. Ho, J. Leu, J. Maiz, T. Scherban,
Effects of passivation layer on stress relaxation and mass transport in electroplated Cu films.
Proceedings of the 7th International Workshop on Stress-Induced Phenomena in Metallization (Austin, Texas, 14-16 June 2004).
AIP Conference Proceedings 741, 256-267 (2004).
R. Huang, Z. Suo,
Morphological instability of solid-on-liquid thin film structures.
MRS Symposium Proceedings, vol. 749, 121-126 (2002).
R. Huang, H. Yin, J. Liang, K. D. Hobart, J. C. Sturm, and Z. Suo,
Relaxation of a strained elastic film on a viscous layer.
MRS Symposium Proceedings, vol. 695, 115-120 (2001).