Updating… Please refer to the google scholar page for a complete list of publications.
[Journal Papers]
T. Li, S. Li, H. Lavasani, and H. Wang, “A Highly Linear and Efficient V -Band CMOS Power Amplifier Using Hybrid NMOS/PMOS for Double Nonlinearity Cancellation With Four-Way Distributed-Active-Transformer,” IEEE J. Solid-State Circuits (JSSC), vol. 59, no. 7, pp. 2145-2158, July 2024.
X. Zhang, S. Li, and T. Chi, “A Millimeter-Wave Watt-Level Doherty Power Amplifier in Silicon,” IEEE Trans. Microw. Theory Techn. (T-MTT), vol. 72, no. 3, pp. 1674-1686, Mar. 2024.
X. Zhang, S. Li, D. Huang, and T. Chi, “A Millimeter-Wave Three-Way Doherty Power Amplifier for 5G NR OFDM,” IEEE J. Solid-State Circuits (JSSC), vol. 58, no. 5, pp. 1256–1270, May 2023.
T. Huang, N. Mannem, S. Li, D. Jung, M. Huang, and H. Wang, “A Coupler Balun Load-Modulated Power Amplifier With Extremely Wide Bandwidth,” IEEE Trans. Microw. Theory Techn. (T-MTT), vol. 71, no. 4, pp. 1573–1586, April 2023.
N. Mannem, T. Huang, E. Erfani, S. Li, D. Munzer, M. Bloch, and H. Wang, “A 25–34-GHz Eight-Element MIMO Transmitter for Keyless High Throughput Directionally Secure Communication,” IEEE J. Solid-State Circuits (JSSC), vol. 57, no. 5, pp. 1244–1256, May 2022.
D. Jung, G. Junek, J. Park, S. Kumashi, A. Wang, S. Li, S. Grijalva, N. Fernandez, H. Cho, and H. Wang, “A CMOS 21 952-Pixel Multi-Modal Cell-Based Biosensor With Four-Point Impedance Sensing for Holistic Cellular Characterization,” IEEE J. Solid-State Circuits (JSSC), vol. 56, no. 8, pp. 2438-2451, Aug. 2021.
S. Kumashi, D. Jung, J. Park, S. Sanz, S. Grijalva, A. Wang, S. Li, H. Cho, C. Ajo-Franklin, and H. Wang, “A CMOS Multi-Modal Electrochemical and Impedance Cellular Sensing Array for Massively Paralleled Exoelectrogen Screening,” IEEE Trans. Biomed. Circuits Syst. (T-BioCAS), vol. 15, no. 2, pp. 221–234, Apr. 2021.
S. Li, M. Huang, D. Jung, T. Huang, and H. Wang, “A MM-Wave Current-Mode Inverse Outphasing Transmitter Front-End: A Circuit Duality of Conventional Voltage-Mode Outphasing,” IEEE J. Solid-State Circuits (JSSC), vol. 56, no. 6, pp. 1732-1744, Jun. 2021.
S. Li, T. Chi, and H. Wang, ““Multi-Feed Antenna and Electronics Co-Design: An E-Band Antenna-LNA Front End With On-Antenna Noise-Canceling and Gₘ-Boosting,” IEEE J. Solid-State Circuits (JSSC), vol. 55, no. 12, pp. 3362–3375, Dec. 2020.
M.-Y. Huang, T. Chi, S. Li, T.-Y. Huang, and H. Wang, “A 24.5–43.5-GHz Ultra-Compact CMOS Receiver Front End With Calibration-Free Instantaneous Full-Band Image Rejection for Multiband 5G Massive MIMO,” IEEE J. Solid-State Circuits (JSSC), vol. 55, no. 5, pp. 1177–1186, May 2020.
D. Jung, S. Li, J. Park, T. Huang, H. Zhao, and H. Wang, “A CMOS 1.2-V Hybrid Current- and Voltage-Mode Three-Way Digital Doherty PA With Built-In Phase Nonlinearity Compensation,” IEEE J. Solid-State Circuits (JSSC), vol. 55, no. 3, pp. 525–535, Mar. 2020.
J. Park, S. Grijalva, D. Jung, S. Li, G. Junek, T. Chi, H. Cho, and H. Wang, “Intracellular Cardiomyocytes Potential Recording by Planar Electrode Array and Fibroblasts Co-Culturing on Multi-Modal CMOS Chip,” Biosensors and Bioelectronics, vol. 144, Aug. 2019.
S. Li, T. Chi, T.-Y. Huang, M.-Y. Huang, D. Jung, and H. Wang, “A Buffer-Less Wideband Frequency Doubler in 45-nm CMOS-SOI With Transistor Multiport Waveform Shaping Achieving 25% Drain Efficiency and 46–89 GHz Instantaneous Bandwidth,” IEEE Solid-State Circuits Lett. (SSCL), vol. 2, no. 4, pp. 25–28, Apr. 2019.
S. Li, T. Chi, J. Park, H. Nguyen, and H. Wang, “A 28-GHz Flip-Chip Packaged Chireix Transmitter With On-Antenna Outphasing Active Load Modulation,” IEEE J. Solid-State Circuits (JSSC), vol. 54, no. 5, pp. 1243–1253, May 2019.
H. Nguyen, T. Chi, S. Li, and H. Wang, “A Linear High-Efficiency Millimeter-Wave CMOS Doherty Radiator Leveraging Multi-Feed On-Antenna Active Load Modulation,” IEEE J. Solid-State Circuits (JSSC), vol. 53, no. 12, pp. 3587–3598, Dec. 2018.
T. Chi, J. Park, S. Li, and H. Wang, “A Millimeter-Wave Polarization-Division-Duplex Transceiver Front-End With an On-Chip Multifeed Self-Interference-Canceling Antenna and an All-Passive Reconfigurable Canceller,” IEEE J. Solid-State Circuits (JSSC), vol. 53, no. 12, pp. 3628–3639, Dec. 2018.
A. Sabzevari, S. Li, E. Garay, H. Nguyen, H. Wang, and N. Tavassolian, “W-Band Micromachined Antipodal Vivaldi Antenna Using SIW and CPW Structures,” IEEE Trans. Antennas Propag. (T-AP), vol. 66, no. 11, pp. 6352–6357, Nov. 2018.
A. Sabzevari, S. Li, E. Garay, H. Nguyen, H. Wang, and N. Tavassolian, “Synthetic ultra-high-resolution millimeter-wave imaging for skin cancer detection,” IEEE Trans. Biomed. Eng. (TBME), vol. 66, no.1, pp. 61–71, Jan. 2019.
J. Park, S. Grijalva, M. Aziz, T. Chi, S. Li, M. Sayegh, A. Wang, H. Cho, and H. Wang, “Multi-parametric cell profiling with a CMOS quad-modality cellular interfacing array for label-free fully automated drug screening,” Lab On a Chip, DOI: 10.1039/C8LC00156A, pp. 3037-3050, Jun. 2018.
J. Park, M. Aziz, S. Li, T. Chi, S. Grijalva, J. Sung, H. Cho, and H. Wang, “1024-Pixel CMOS Multimodality Joint Cellular Sensor/Stimulator Array for Real-Time Holistic Cellular Characterization and Cell-Based Drug Screening,” IEEE Trans. Biomed. Circuits Syst. (T-BioCAS), vol. 12, no. 1, pp. 80–94, Feb. 2018.
T. Chi, S. Li, J. Park, and H. Wang, “A Multifeed Antenna for High-Efficiency On-Antenna Power Combining,” IEEE Trans. Antennas Propag. (T-AP), vol. 65, no. 12, pp. 6937–6951, Dec. 2017.
S. Li, T. Chi, Y. Wang, and H. Wang, “A Millimeter-Wave Dual-Feed Square Loop Antenna for 5G Communications,” IEEE Trans. Antennas Propag. (T-AP), vol. 65, no. 12, pp. 6317–6328, Dec. 2017.
M. Yi, S. Li, H. Yu, W. Khan, C. Ulusoy, A. Lopez, J. Papapolymerou, M. Swaminathan, “Surface Roughness Modeling of Substrate Integrated Waveguide in D-Band,” IEEE Trans. Microw. Theory. Tech. (TMTT), vol. 64, no. 4, pp. 1209–1216, Apr. 2016.
[Conference Papers]
N. Villaggi, Y. Liu, T. Huang, S. Li, T. Chi, and H. Wang, “A 27-39GHz 48Gbit/s 8-Channel Phased Array Transceiver Frontend with Broadband TX/RX Co-Design Optimization”, in Proc. IEEE Custom Integrated Circuits Conf. (CICC), Apr. 2025.
H. Yu, L. Liu, and S. Li, “A Blocker-Tolerant mm-Wave Low-Noise Amplifier Utilizing Doherty Active Load Modulation for Linearity Enhancement”, in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2025.
H. Chae, S. H. Chai, T. Chi, S. Li, and D. Pan, “(Invited Paper) ML-Assisted RF IC Design Enablement: the New Frontier of AI for EDA”, in 30th Asia and South Pacific Design Automation Conference (ASP-DAC), Jan. 2025.
H. Chae*, H. Yu*, S. Li, and D. Pan, “PulseRF: Physics Augmented ML Modeling and Synthesis for High-Frequency RFIC Design”, in Proc. IEEE/ACM International Conference on Computer Aided Design (ICCAD), Oct. 2024. (* Equally credited authors)
S. Dong, N. Sharma, S. Li, M. Chen, X. Zhang, Y. Hu, J. Li, Y. Su, X. Xu, V. Loseu, E. Seok, T. Chi, W.-S. Choi, and G. Xu, “A 140GHz RF Beamforming Phased-Array Receiver Supporting >20dB IRR with 8GHz Channel Bandwidth at Low IF in 22nm FDSOI CMOS,” in Proc. IEEE RF Integrated Circuits Symp. (RFIC), June 2023. ― 2023 IEEE RFIC Industry Paper Award Finalist
X. Zhang, S. Li, and T. Chi, “A 38GHz Power-Combined Doherty PA Based on an Extended Rat-Race Coupler Achieving 27.5dBm Saturated Power and 15.0% Efficiency at 6dB Back-Off,” in Proc. IEEE Custom Integrated Circuits Conf. (CICC), Apr. 2023.
X. Zhang, S. Li, D. Huang, and T. Chi, “A 38GHz Deep Back-Off Efficiency Enhancement PA with Three-Way Doherty Network Synthesis Achieving 11.3dBm Average Output Power and 14.7% Average Efficiency for 5G NR OFDM,” in Proc. IEEE RF Integrated Circuits Symp. (RFIC), June 2022. ― 2022 IEEE RFIC Best Student Paper Award Finalist
T. Li, S. Li, H. Lavasani, and H. Wang, “A V-band doubly hybrid NMOS/PMOS four-way distributed-active-transformer power amplifier for nonlinearity cancellation and joint linearity/efficiency optimization,” in Proc. IEEE International Microwave Symposium (IMS), Jun. 2021. ― 2021 IEEE IMS Best Student Paper Finalist
T. Huang, S. Li, N. Mannem, and H. Wang, “A 35–100GHz Continuous Mode Coupler Balun Doherty Power Amplifier with Differential Complex Neutralization in 250nm InP,” in Proc. IEEE International Microwave Symposium (IMS), Jun. 2021. ― 2021 IEEE IMS Best Student Paper Award (2nd Place)
S. Li, T. Huang, Y. Liu, H. Yoo, Y. Na, Y. Hur, and H. Wang, “A Millimeter-Wave LNA in 45nm CMOS SOI with Over 23dB Peak Gain and Sub-3dB NF for Different 5G Operating Bands and Improved Dynamic Range,” in Proc. IEEE RF Integrated Circuits Symp. (RFIC), June 2021.
N. Mannem, T. Huang, E. Erfani, S. Li, and H. Wang, “A Mm-Wave Transmitter MIMO with Constellation Decomposition Array (CDA) for Keyless Physically Secured High-Throughput Links,” in Proc. IEEE RF Integrated Circuits Symp. (RFIC), June 2021. ― 2021 IEEE RFIC Best Student Paper Award (2nd Place)
T. Huang, N. Mannem, S. Li, D. Jung, M. Huang, and H. Wang, “A 26-to-60GHz Continuous Coupler-Doherty Linear Power Amplifier for Over-An-Octave Back-Off Efficiency Enhancement,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2021.
S. Li, M. Huang, D. Jung, T. Huang, and H. Wang, “A 28GHz Current-Mode Inverse-Outphasing Transmitter Achieving 40%/31% PA Efficiency at Psat/6dB PBO and Supporting 15Gbit/s 64-QAM for 5G Communication,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2020.
S. Li, T. Chi, D. Jung, T.-Y. Huang, M.-Y. Huang, and H. Wang, “An E-Band High-Linearity Antenna-LNA Front-End with 4.8dB NF and 2.2dBm IIP3 Exploiting Multi-Feed On-Antenna Noise-Canceling and Gm-Boosting,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2020.
D. Jung, S. Kumashi, J. Park, S. Sanz, S. Grijalva, A. Wang, S. Li, H. Cho, C. Ajo-Franklin, and H. Wang, “A CMOS Multimodality In-Pixel Electrochemical and Impedance Cellular Sensing Array for Massively Paralleled Synthetic Exoelectrogen Characterization,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2020.
N. Mannem, M. Huang, T. Huang, S. Li, and H. Wang, “A Reconfigurable Series/Parallel Quadrature-Coupler-Based Doherty PA in CMOS SOI with VSWR Resilient Linearity and Back-Off PAE for 5G MIMO Arrays,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2020.
S. Lee, M. Smith, S. Li, and H. Wang, “An Ultra-Wideband Edge-Fed Octagonal Four-Arm Archimedean Spiral Antenna,” in Proc. IEEE AP-S/URSI (APS), June 2019.
D. Jung, J. Park, G. Junek, S. Grijalva, S. Kumashi, A. Wang, S. Li, H. Cho, and H. Wang, “A 21952-pixel multi-modal CMOS cellular sensor array with 1568-pixel parallel recording and 4-point impedance sensing,” in Proc. IEEE VLSI Tech. Cir. Symp. (VLSI), June 2019.
H. Wang, F. Wang, T. Li, H. Nguyen, S. Li, and T. Huang, “Broadband, Linear, and High-Efficiency Mm-Wave PAs in Silicon―Overcoming Device Limitations by Architecture/Circuit Innovations,” in Proc. IEEE International Microwave Symposium (IMS), Jun. 2019.
M. Huang, T. Chi, F. Wang, S. Li, T. Huang, and H. Wang, “A 24.5-43.5GHz Compact RX with Calibration-Free 32-56dB Full-Frequency Instantaneously Wideband Image Rejection Supporting Multi-Gb/s 64-QAM/256-QAM for Multi-Band 5G Massive MIMO,” in Proc. IEEE RF Integrated Circuits Symp. (RFIC), June 2019.
D. Jung, J. Park, S. Li, T. Huang, H. Zhao and H. Wang, “A 1.2 V single supply hybrid current-
/Voltage-mode three-way digital Doherty PA with built-in large-signal phase compensation achieving less than 5° AM-PM,” in Proc. IEEE Custom Integrated Circuits Conf. (CICC), May 2019. ― 2019 IEEE CICC Best Student Paper Award.
H. Nguyen, S. Li, and H. Wang, “A mm-wave 3-way linear Doherty radiator with multi antenna coupling and on-antenna current-scaling series combiner for deep power back-off efficiency enhancement,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2019.
S. Li, H. Nguyen, T. Chi, C. Li, N. Cahoon, A. Kumar, G. Freeman, D. Harame, and H. Wang, “Performance of V-Band On-Chip Antennas in GlobalFoundries 45nm CMOS SOI Process for Mm-Wave 5G Applications,” in IEEE MTT-S Int. Microwave Symp. (IMS), June 2018.
S. Li, T. Chi, H. Nguyen, T. Huang, and H. Wang, “A 28GHz Packaged Chireix Transmitter with Direct On-Antenna Outphasing Load Modulation Achieving 56%/38% PA Efficiency at Peak/6dB Back-Off Output Power,” in Proc. IEEE RF Integrated Circuits Symp. (RFIC), June 2018. ― 2018 IEEE RFIC Best Student Paper Award (2nd place)
H. Nguyen, T. Chi, S. Li, and H. Wang, “A 62-to-68GHz Linear 6Gb/s 64QAM CMOS Doherty Radiator with 27.5%/20.1% PAE at Peak/6dB-Back-Off Output Power Leveraging High-Efficiency Multi-Feed Antenna-Based Active Load Modulation,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2018, pp. 402–403.
T. Chi, J. Park, S. Li, and H. Wang, “A 64GHz Full-Duplex Transceiver Front-End with An On-Chip Multifeed Self-Interference-Canceling Antenna and An All-Passive Canceler Supporting 4Gb/s Modulation in One Antenna Footprint,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2018, pp. 76–77.
H. Wang, S. Hu, T. Chi, F. Wang, S. Li, M. Huang, and J. Park, “Towards Energy-Efficient 5G Mm-Wave Links: Exploiting Broadband Mm-Wave Doherty Power Amplifier and Multi-Feed Antenna with Direct On-Antenna Power Combining,” in Proc. IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), Oct. 2017. (Invited)
J. Park, M. Aziz, S. Gonzalez, D. Jung, T. Chi, S. Li, H. C. Cho, and H. Wang, “A CMOS 22k-Pixel Single-Cell Resolution Multi-Modality Real-Time Cellular Sensing Array,” in Proc. IEEE Custom Integrated Circuits Conf. (CICC), May 2017.
T. Chi, M. Huang, S. Li, and H. Wang, “A Packaged 90-to-300GHz Transmitter and 115-to-325GHz Coherent Receiver in CMOS for Full-Band Continuous-Wave Mm-Wave Hyperspectral Imaging,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2017, pp. 304–305.
T. Chi, F. Wang, S. Li, M. Huang, J. Park, and H. Wang, “A 60GHz On-Chip Linear Radiator with Single-Element 27.9dBm Psat and 33.1dBm Peak EIRP Using Multifeed Antenna for Direct On-Antenna Power Combining,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2017, pp. 296–297.
S. Li, M. Yi, S. Pavlidis, H. Yu, M. Swaminathan, and J. Papapolymerou, “Investigation of surface roughness effects for D-band SIW transmission lines on LCP substrate,” in Proc. IEEE Radio and Wireless
Symposium (RWS), March 2017.
S. Li, T. Chi, J. Park, and H. Wang, “A Multi-Feed Antenna for Antenna-Level Power Combining,” in Proc. IEEE Int. Symp. Antennas Propag. (APSURSI), June 2016.
S. Li, T. Chi, W. Tanveer, J. Papapolymerou, and H. Wang, “A Fully Packaged D-Band MIMO Transmitter Using High-Density Flip-Chip Interconnects on A Flexible LCP Substrate,” in IEEE MTT-S Int. Microwave Symp. (IMS), May 2016.
