MEMS Processing Microelectronic Research Center Learning and working on MEMS processing~ Currently, I’m learning the MEMS processing at the Microelectronic Research Center of UT Austin. Generally, senior students in lab will train new students, but senior students (like DK, Carly, Randy, and Yoonho) already graduated . So, I have to learn the cleanroom staff by myself. Even though this takes much time to be familious with the microfabrication, I think it’s interesting and worthy. I try to sort and write down what I learn, experience, tips, or manuals on this page, which maybe beneficial for subsequent students. Xiaoyu Niu’s thinking about the webpage CMUT Fabrication_Adding Pt layer_Fall 2021Fabrication Progress Sheet_Summer 2021 Tool EVG 620 Aligner Mask Aligner (EVG 620): Back-Side Alignment (BSA)Aligner (EVG 620): measure the uv intensity DSE/DRIE/ICP Deep Silicon Etcher DSE/DRIE/ICP Deep Silicon EtcherDRIE Process Development and Mask Selection: Cr, SiO2, AZ5214 Oxford ICP RIE 100 Oxford RIE 80 L10 Hood Dektak 150 Profilometer ALD Banerjee Al2O3 deposition: one side KJL (Old) Sputter 790 Plasma Therm PECVD – Polysilicon/SiN/SiO2 MRL Furnace (Field) Acid Hood (C-16) J.A. Woollam Ellipsometer Univex 450 Klin MA6 Aligner Introduction HMDS Oven Tepla Asher March Asher introduction Acid Hood (H14) (SiO2 Vapor Etching)(the specific tool built by Jesse) ACT Dicing Saw (South Clean Room) Carl Zesis SEM Process SU8-3005 Photoresist Process RecipeAZ9260 Photoresist Process RecipeAZ5214-IR Series Photoresist Process RecipeAZ5214 Positive Photoresist Process recipe_Xiaoyu Niuomnicoat spin coatingHow to cut the wafer into stripes to check the cross-section?SU8 PR Removal: lift-off (wet) vs. Dry-etch Questions/Problems Differences between EVG Aligner and MA6 Aligner Differences among several silicon etchers (Yoonho Email)Differences among etchersDSE: use SiO2 as masksOrientation of the wafer latticeP-type or N-type? Recipe DSEXN Mounted Standard DSE CAS_Mounted DSE Standard
